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BR-HTE-2RT


▲ (Left)Prepreg side / (Right)Resist side
BR-HTE-2RT is shiny side treated E.D. copper foil, characterized by high temperature elongation property. By precisely controlling the plating on the shiny side, the copper nodule can be well controlled in size(sub-micron) and distribution. That can offer very low roughness(Rz<2um) and proper bonding to prepregs.

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Benefits

  • Advanced reverse treatment, Grade 3 pink copper foil
  • Uniform sub-micron nodulization and low roughness (Rz ≦ 2um)

Applications

  • High frequency applications
  • Server applications

PROPERTIES

Item Unit Toz
1/3oz		 Joz
3/7oz		 Hoz
1/2oz		 1oz 2oz
12μm 15μm 18µm 35µm 70µm
Area weight g/m^2 107±7 125±8 153±10 285±15 585±20
Tensile
Strength		 R.T. Kgf/mm^2 ≧24
H.T. Kgf/mm^2 ≧14
Elongation R.T. % ≧3 ≧3 ≧4 ≧5 ≧5
H.T. % ≧3 ≧3 ≧2 ≧2 ≧2
Roughness Resist side
(Rz)		 µm ≦5.0 ≦6.0 ≦6 ≦8 ≦12
Prepreg side
(Rz)		 µm ≦2.0 ≦2.0 ≦2.0 ≦2.0 ≦2.0
Prepreg side
(Rq)		 µm ~0.25 ~0.25 ~0.25 ~0.25 ~0.25
Peel High Tg
Prepreg		 kgf/cm
(lbf/in)		 ≧ 0.44
(≧ 2.5)		 ≧ 0.50
(≧ 2.8)		 ≧ 0.54
(≧ 3.0)		 ≧ 0.71
(≧ 4.0)		 ≧ 0.89
(≧ 5.0)

1)Roughness is determined by contact stylus profilometer(JIS94).
2)Peel is evaluated by using 4 pieces of H-Tg prepregs(7628).
3)R/S(Rz) is the roughness Rz of the resist side.

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