BR-HTE-2RT


▲ (Left)Prepreg side / (Right)Resist side
BR-HTE-2RT is shiny side treated E.D. copper foil, characterized by high temperature elongation property. By precisely controlling the plating on the shiny side, the copper nodule can be well controlled in size(sub-micron) and distribution. That can offer very low roughness(Rz<2um) and proper bonding to prepregs.

Product information by Download

Benefits

  • Advanced reverse treatment, Grade 3 pink copper foil
  • Uniform sub-micron nodulization and low roughness (Rz ≦ 2um)

Applications

  • High frequency applications
  • Server applications

PROPERTIES

Item Unit Hoz
1/2oz
1oz 2oz
18µm 35µm 70µm
Foil type *** 2RT 2RT 2RT
Area weight g/m^2 153±10 285±15 585±20
Tensile
Strength
R.T Kgf/mm^2 ≧24
H.T Kgf/mm^2 ≧14
Elongation R.T % ≧4 ≧5 ≧5
H.T % ≧3 ≧3 ≧2
Roughness R/S(Rz) µm ≦5.0 ≦7.0 ≦9.0
M/S(Rz) µm ≦2.0 ≦2.0 ≦2.0
M/S(Rq) µm ~0.25 ~0.25 ~0.25
Peel High Tg
Prepreg
kgf/cm
(lbf/in)
≧ 0.54
(≧ 3.0)
≧ 0.71
(≧ 4.0)
≧ 0.89
(≧ 5.0)

1)Roughness is determined by contact stylus profilometer(JIS94).
2)Peel is evaluated by using 4 pieces of H-Tg prepregs(7628).
3)R/S(Rz) is the roughness Rz of the resist side.

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