BR-DSS-LX Series


▲ Prepreg side
BR-DSS-LX Series is double shiny side base foil and single side treated E.D. copper foil, characterized by high temperature elongation property. By precisely controlling the plating on the shiny side, the copper nodule can be well controlled in size(sub-micron) and distribution. That can offer very low roughness(Rz<2um) and proper bonding to prepregs.

Product information by Download

Benefits

  • Very low profile, brown copper foil
  • Uniform and sub-micron anchoring treatment

Applications

  • High frequency applications
  • Fine-line circuit boards

PROPERTIES

BR-DSS-LLX

Item Unit Qoz
1/4oz
Toz
1/3oz
Hoz
1/2oz
1oz 2oz
9µm 12µm 18µm 35µm 70µm
Foil type *** LLX LLX LLX LLX LLX
Area Weight g/m^2 83±6 107±7 153±10 285±15 585±15
Tensile
Strength
R.T Kgf/mm^2 ≧24
Elongation R.T % ≧3
H.T % ≧3
Roughness S/S(Ra) µm ≦0.35
S/S(Rq) µm ~0.26
M/S(Rz) µm ≦3.0 ≦3.0 ≦3.0 ≦3.0 ≦3.0
M/S(Rq) µm *** *** ~0.25 ~0.25 ~0.25
Peel Ultra
Low Loss
Preperg
kgf/cm
(lbf/in)
≧1.0 ≧1.3 ≧0.5
(≧2.9)
≧0.6
(≧3.4)
≧0.7
(≧4.0)

1)Roughness is determined by contact stylus profilometer(JIS94).
2)Peel is evaluated by 4 pieces of Ultra Low Loss Prepregs(7628).



BR-DSS-2LX

Item Unit Boz
2/9oz
Qoz
1/4oz
Toz
1/3oz
Hoz
1/2oz
1oz
8µm 9µm 12µm 18µm 35µm
Foil type *** 2LX 2LX 2LX 2LX 2LX
Area Weight g/m^2 73±5 83±6 107±7 153±10 285±15
Tensile
Strength
R.T Kgf/mm^2 ≧24
Elongation R.T % ≧2 ≧3
H.T % ≧2 ≧3
Roughness S/S(Ra) µm ≦0.30
S/S(Rq) µm ~0.26
M/S(Rz) µm ≦2.0 ≦2.0 ≦2.0 ≦2.0 ≦2.0
M/S(Rq) µm *** *** *** ~0.20 ~0.20
Peel Ultra
Low Loss
Preperg
kgf/cm
(lbf/in)
*** *** *** ≧0.45
(≧2.6)
≧0.6
(≧3.4)

1)Roughness is determined by contact stylus profilometer(JIS94).
2)Peel is evaluated by using 4 pieces of Ultra Low Loss prepregs(7628).

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